April 13, 2021
Technical Tuesday The “Next Leap”: Diffusion Bonding for Critical Component Manufacturing With "advances in electric vehicle transportation, semiconductor fabrication, novel material development, and miniaturization, the ‘performance envelope’ continues to broaden." This requires revisiting some tried and true heat treating techniques and their applications.
Read on to see what Tom Palamides, senior sales and product manager at PVA TePla America, Inc., has to say about how diffusion bonding may replace brazing for certain applications.
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HIPing: Download the Ebook Today! Heat Treat Today is excited to bring you a NEW and FREE ebook!
Hot isostatic pressing (HIP) is seeing a renaissance. It has been an essential process to densify porosity and improve the mechanical properties of materials for components. The outlook for HIP technology has never been brighter, helped by technology shifts that are accelerated by recent global events.
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